Scopes
Information and Telecommunications engineering
Conductive metals and their alloys
artificial intelligence
Electromagnetic shielding materials
Bioinformatics
Dielectric materials
software engineering
Piezoelectric and ferroelectric materials
Design and Manufacture of Very Large Scale Integration
magnetic material 
Photon technology
Optoelectronic materials
Parallel and distributed computing
battery
data mining 
Microelectronic materials
Cryptography
power electronics 
Algorithms and Data Structures
Advanced Power Semiconductor
Numbers and combinations
Distributed power generation, fuel cells, and renewable energy systems
E-commerce and e-learning
Electromagnetic compatibility
Geographic Information System
Wearable electronic material 14. network
electronic packaging 
signal processing 
Two-dimensional material flexible optoelectronic devices
Embedded system 
integrated circuit
Communication and wireless systems
sensor
Multimedia Systems and Applications
Electronic Information Computer Materials
Emerging technologies
electronic packaging 
2D material flexible optoelectronic devices
integrated circuit
sensor
Electronic Information Computer Materials
Important Dates | 重要日期
  • Submission Deadline: 2024.6.8
  • Registration Deadline: 2024.6.13
  • Conference Date: 2024.6.18
  • Notification Date: About a week after the submission
Submission Portal | 投稿方式

Mail Address:  conference_info@163.com

If you have any question or need any assistance regarding the conference, please feel free to contact our conference specialists:

詹老师
  • 16786905125
  • 1738651186
冯老师
  • 17780683172
  • 2533895639
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